Product Features
- Exceptional Thermal Resistance
- Excellent Mechanical Properties
- High Impact Strength and Durability
- Suitable for Engineering Purpose
- Comes with High Temperature Reusable Spool
- Diameter: 1.75mm +/- 0.03mm
Cautions for Use
- Dry out before use
- AMS Compatible
- Enclosure Printers Required
Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
| Hotend | All Size / Material | / |
| Glue | Glue Stick | Bambu Liquid Glue |
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No more tedious setting steps.
